In the course of repairs it is sometimes necessary to replace components on a PCB or a substrate. To do this, soldering paste must be applied directly and in the exact quantity.
Our CK Rework Stencils make this process more secure. Why? Individually worked steps center the component to be replaced and simplify the handling radically.
Profit now from a highly accurate and efficient solution, including holding frame for your Rework Stations.
We are also happy to support you with supplementary process consulting and evaluations in our Application Center.
Alternatively soldering paste can also be used. The cavity depth is specified by the Dip depth.
Lift out BGA after dipping (imprints in backlight)
ERSASCOPE image, div. focus joined with ImageDoc FocusFusion
Flux-Gel on BGA225 Ball (ERSASCOPE Image)
Depot on BGA225 Balls, div. focus merged with ImageDoc FocusFusion
With a component-specific Rework Stencil components without small legs, e.g. QFN- or MLF-designs, are printed directly. BGAs or the ground planes of QFP-designs can also be printed directly. The fixture fixes the component and the stencil, to simplify the handling.
The printing process provides a reproducible quantity of solder for the charge.
ERSA PL650A Placement system
Component and product-specific stencils enable the printing of the installation position for the component directly on the PCB.
Christian Koenen GmbH HighTech Stencils Otto-Hahn-Straße 24 85521 Ottobrunn-Riemerling Germany
T +49 89 66 56 18 - 0 F +49 89 66 56 18 - email@example.com
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