CK Balling stencil

Precise apertures, exact positioning.

The production of semiconductors places the highest demands on the efficiency. You want to mount Flipchip-Bumps as efficiently as possible on Wafer or Substrate?


With CK Balling Stencils you raise the productivity of your semiconductor production to a new level. The secret: With our patented milling process we also complement the laser-cut apertures with the necessary spacer.

This time-saving process brings you two important benefits: position-exact apertures and short delivery times.

May we support you in the run-up to your decision? We are happy to support you with additional process consulting and evaluations in our Application Center.


Your benefits:

  • High precision and reproducibility for apertures and spacers
  • Shorter delivery times in comparison to galvanically built-up stencils
  • Optional process evaluation in the CK Application Center


Christian Koenen GmbH
HighTech Stencils

Otto-Hahn-Straße 24
85521 Ottobrunn-Riemerling


+49 89 66 56 18 - 0
F +49 89 66 56 18 - 330

Up to date

Don't miss any more news, subscribe here to our Newsletter.



© 2022 Christian Koenen GmbH