Products

CK Balling stencil

Precise apertures, exact positioning.

The production of semiconductors places the highest demands on the efficiency. You want to mount Flipchip-Bumps as efficiently as possible on Wafer or Substrate?

 

With CK Balling Stencils you raise the productivity of your semiconductor production to a new level. The secret: With our patented milling process we also complement the laser-cut apertures with the necessary spacer.


This time-saving process brings you two important benefits: position-exact apertures and short delivery times.


May we support you in the run-up to your decision? We are happy to support you with additional process consulting and evaluations in our Application Center.

 

Your benefits:

  • High precision and reproducibility for apertures and spacers
  • Shorter delivery times in comparison to galvanically built-up stencils
  • Optional process evaluation in the CK Application Center

Contact

Christian Koenen GmbH
HighTech Stencils

Otto-Hahn-Straße 24
85521 Ottobrunn-Riemerling
Germany

 

+49 89 66 56 18 - 0
F +49 89 66 56 18 - 330

info@ck.de

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