The production of semiconductors places the highest demands on the efficiency. You want to mount Flipchip-Bumps as efficiently as possible on Wafer or Substrate?
With CK Balling Stencils you raise the productivity of your semiconductor production to a new level. The secret: With our patented milling process we also complement the laser-cut apertures with the necessary spacer.
This time-saving process brings you two important benefits: position-exact apertures and short delivery times.
May we support you in the run-up to your decision? We are happy to support you with additional process consulting and evaluations in our Application Center.
Christian Koenen GmbH HighTech Stencils Otto-Hahn-Straße 24 85521 Ottobrunn-Riemerling Germany
T +49 89 66 56 18 - 0 F +49 89 66 56 18 - firstname.lastname@example.org
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