In the manufacture of ceramic-based circuit carriers (Low Temperature Cofired Ceramic) switching levels must be reliably contacted through.
Our laser-cut LTCC stencils (VIA-Fill-Stencils) have superfine openings, that are placed position-exact on the Micro-VIAs of the ceramic substrate. If the silver paste is applied to the stencil, the apertures conduct this like a funnel in the VIAs.
With the VIA-Fill process play it safe and decide on precise connections and minimal deviations along the tolerance chain. And that with apertures from 50µm and a position accuracy of ± 10µm.
We are also happy to support you with supplementary process consulting and evaluations in our Application Center.
Christian Koenen GmbH HighTech Stencils Otto-Hahn-Straße 24 85521 Ottobrunn-Riemerling Germany
T +49 89 66 56 18 - 0 F +49 89 66 56 18 - firstname.lastname@example.org
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