Knowledge That Counts in the Printing Process: A Technical Deep Dive with Scanfil

How a joint workshop became the foundation of a resilient technology partnership – and what it means for your production.

Some challenges cannot be solved with standard solutions. When component sizes shrink, materials grow more complex and tolerances tighter, what matters is having the right knowledge transfer at the right moment.

Together with Scanfil, we showed what that looks like in practice.

Sharing Knowledge. Securing Processes. Growing Together.

Representatives of the Scanfil Group from four countries – Estonia, Sweden, Poland and Germany – came to our facility in Ottobrunn for an intensive workshop. The goal: no sales pitch, no product catalogue – just genuine knowledge transfer across the entire SMT printing process. Our experts Tim Böck and Sebastian Bechmann guided participants through the full spectrum of modern stencil technology: from standard processes and fine-pitch structures to complex step stencils and specialised applications. Hands-on, at eye level, and with a clear focus on what truly matters in production.

Why Workshops Deliver More Than Consulting

A workshop creates something no presentation can replace: shared understanding. When production teams across different sites share the same technical context, processes emerge that work consistently – regardless of where they are deployed. That was the goal of the workshop. And it worked.

What Participants Take Away

A deep understanding of the interactions between stencil, solder paste and PCB geometry. The expertise to independently evaluate printing parameters. And a direct line to our specialists for future questions.

From Knowledge Directly Into Production

What followed the workshop demonstrates the tangible value of such partnerships: immediately afterwards, a joint pilot project was launched at Scanfil's Wutha facility, tackling a highly complex electronic assembly.
The requirements were demanding:

▸ Printing 01005 components on polyimide flex PCBs
▸ Reliable printing of BGA pads with diameters below 100 µm
▸ Compensation of material changes caused by thermal processes

The result: a custom-developed step stencil and an optimised printing process delivering reproducible results even at extreme miniaturisation levels. Even this exceptionally small and complex assembly can now be manufactured reliably and economically.

What This Means for Your Production

Every manufacturing operation faces its own challenges – varying substrate types, smaller components, tighter process tolerances. Our approach: we work with you before a problem arises. Not only once the printing process starts to fail.

Technology That Scales

The Scanfil case is not an isolated example. It stands for what we offer our customers in electronics manufacturing: not a stencil supplier – but a technology partner who understands the entire printing process.

The portfolio we bring to the table is as broad as the demands of modern electronics manufacturing:

▸ Step stencils with patented milling process for varying solder paste volumes
▸ CK Nanovate™ Nickel for maximum precision at the smallest apertures
▸ Plasma coating for improved paste release and extended stencil lifetime
▸ Application Center: analysis, consulting and process optimisation – directly at our facility

Facing similar challenges in your printing process? Talk to our experts – straightforward, direct and tailored to your production.

Newsroom

Knowledge That Counts in the Printing Process: A Technical Deep Dive with Scanfil

Sharing Knowledge. Securing Processes. Growing Together.

Why Workshops Deliver More Than Consulting

From Knowledge Directly Into Production

Technology That Scales

Knowledge That Counts in the Printing Process: A Technical Deep Dive with Scanfil

PCB support and tooling

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