The first half of the in-house event was characterised by four exciting lectures about fine-pitch printing. CEO Michael Brianda took us through the program, supported by specialist lectures from Michael Zahn (Head of Business Development) and Sebastian Bechmann (Head of Application). Two special highlights were Stephan Dietrich, Senior Process Engineer at GS Swiss PCB AG, who spoke about the future of miniaturisation in PCBs and Axel Lindloff, Senior Process Specialist at Koh Young Europe, on the automatic measurement of very small solder deposits.
During the subsequent company tour the interested guests experienced, how complex such a stencil manufacture is, how our machines mill off wafer thin foil accurate to a micron and how intensive the quality inspection is. To experience all this live leaves behind a lasting impression – as well as the fact, that despite this great effort we deliver within 24 hours. "One could really sense the significance in the manufacture", commented a participant. "That really must have taken a lot of experience!"