Review: 16th Technology Seminar "We are going in depth"

Perfecting soldering, reducing the CO2 footprint, digitising future-oriented – these essential topics for the assembly and connection technology must be dealt with in depth, to be effective. This was the requirement followed by the 16th Technology Seminar, which took place in Dresden on 28th/29th September, under the motto "We are going in depth".

With a top class program of specialist lectures, networking and exchange of experiences the organisers ensured, that the expectations of the 60 participants were more than satisfied. On the first day, among others Helge Schimanski from the Fraunhofer ISIT spoke about low melting solder alloys (LTS) and their potential with regard to sustainability and future orientation. Before that Dr. Karin Hergert from Rehm Thermal Systems, Adrian Teuber and Fabian Autenrieth from the ASYS Group and Marco Dörr from STANNOL had dealt with other pressing questions about electronics production.

The networking evening also impressed with high quality and culminated in an intensive exchange of ideas concerning the digitisation and automation of manufacturing facilities.

During the course of the second day CK Managing Director Michael Brianda explained, what contribution precision stencils and PCB supports make towards the optimisation of the precision print. In the final lecture Prof. Mathias Nowottnick from the Rostock University scrutinised the technological basis of the digitisation and thereby covered a fascinating range including artificial intelligence and quantum computing.

Besides Christian Koenen, the sponsors also included ASYS, Rehm and Stannol as well as ASMPT, Vliesstoff Kasper and ZEVAC. All companies are connected by many years of collaboration.

From the perspective of Christian Koenen the seminar was again a complete success. "We are particularly pleased, that besides many big well-known companies, small and medium-sized companies were also represented", summed up Michael Brianda. "That is pleasing evidence for how high the relevance of the topics is and that it is worthwhile for everyone to go into depth. We are already looking forward to the next issue of the Technology Seminar!"

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Review: 16th Technology Seminar "We are going in depth"

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