10 / 2023
We look forward to seeing you at the International Microelectronics Assembly and Packaging Society (IMAPS) Conference on October 19-20, 2023!
Join us for our exciting presentation on Friday.
Innovation in advanced packaging through 3D stencil printing
Let Christian Ossmann take you into the world of 3D stencil printing and discover innovative approaches for modern packaging.
See you soon at the IMAPS Conference 2023!
Christian Koenen GmbH HighTech Stencils Otto-Hahn-Straße 24 85521 Ottobrunn-Riemerling Germany
T +49 89 66 56 18 - 0 F +49 89 66 56 18 - firstname.lastname@example.org
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