We look forward to seeing you at the International Microelectronics Assembly and Packaging Society (IMAPS) Conference on October 19-20, 2023!
Join us for our exciting presentation on Friday.
Presentation topic:
Innovation in advanced packaging through 3D stencil printing
Speaker:
Christian Ossmann
Let Christian Ossmann take you into the world of 3D stencil printing and discover innovative approaches for modern packaging.
See you soon at the IMAPS Conference 2023!