Rework SMD stencils
Rework stencils are used to very specifically dip (immerse in flux or solder paste) or to precisely print components. A combination of both applications is also possible, for example where the ground plane of a component is printed and the angle pins are dipped.
Dip stencil
The depth of the cavity in the dip stencil determines the flux or paste height on the component. The dip medium is pushed into the cavity with a squeegee. The component is then dipped in the medium until the bottom of the cavity is reached.
When the component is lifted out, a reproducible amount of the dip medium remains on the surface of the component connections and is thus available for repair soldering.
This procedure is suitable for all BGA design sizes and for components with a sufficiently large height difference between the angle pins and component body.
Print stencil
Components without angle pins, e.g. QFN or MLF components, can be directly printed with a component-specific rework stencil. BGAs or the ground planes of QFP components can also be directly printed.
The device holds the component and the stencil, making handling easier.
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