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3D stencils – simultaneous printing on multiple levels

This newly developed process for SMD stencils differs from normal step technology. 3D technology is used to facilitate simultaneous printing on several levels of a substrate, or to compensate for elevations or recesses on the substrate.

 

We have developed special squeegees for this 3D technology that follow the stencil surface during printing.

Technical information

  • Stencil thickness of base material: 75 µm up to 2000 µm
  • Ascending and descending steps are possible on both sides.
  • Step technology offers a number of options for special applications.

Christian Koenen GmbH
HighTech Stencils

Otto-Hahn-Strasse 24
85521 Ottobrunn-Riemerling
Germany

T +49 89 66 56 18 - 0
F +49 89 66 56 18 - 330

info@ck.de
www.ck.de

 

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