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SMD Stencils and Semicon Stencils - precise and economical

SMD Stencils and Semicon Stencils are indispensable tools of the assembly and connection technology. Their task is to apply printing pastes or paste systems onto circuit boards and other substrates made from ceramic, glass or silicon (in most cases wafers). Thereby among other things soldering paste, sintering paste, flux (fluxing agent), adhesive or silicon is printed. The substrates are then assembled with electronic components or semiconductor elements. For contacting the SMD components or microchips used, these are placed directly on the contacting surface and then connected by means of thermal processes.

SMD and Semicon stencils are used in a variety of areas of electronics production – from SMD- and LTCC-technology, thick-film hybrid technology through to Wafer-Bumping and Flip-Chip Assembly.

Whether for automotive, medicine technology or semiconductor production:

At Christian Koenen you get the perfect precision tool for your individual requirement in the shortest possible time. The CK SMD stencils and Semicon stencils are manufactured in top quality with the latest production technology and are designed for optimal production.

You want to know more about SMD stencils and SEMICON stencils, their manufacture and application? Below we would be happy to answer the most important questions.

What is an SMD stencil?

SMD stencils are precision printing forms for the assembly of circuit boards with surface mounted components (Surface Mounted Devices). An SMD stencil typically consists of a metal foil. Besides foils made of stainless steel or CK Nanovate™ nickel and other materials are also used.

For the precise SMD stencil print openings are cut out of the foil with a laser. Later the printing paste is combed onto the circuit board through these openings. In the case of soldering paste or adhesive the SMD stencils are also called soldering paste stencil or adhesive stencil.

The tiny openings, through which soldering paste or adhesive is "combed" onto the circuit board with SMD stencil printing, are also called apertures. The printed areas on the substrate are called pads. In the case of an SMD soldering paste stencil the apertures frequently match the precise image of the connecting surfaces on the circuit board for the assembly of the SMD components.

Step stencil

Step stencil from Christian Koenen with circuit board:

The very precisely milled CK Step stencil is aligned exactly to the surface contour of the circuit board, and therefore provides the right quantity of paste for every component.

Is there a difference between SMD stencil and Semicon stencil?

SMD stencils and Semicon stencils address different areas of electronics production. While the SMD stencil is used for the circuit board or substrate assembly, Semicon stencils are used for the semiconductor production. An example for a purely Semicon stencil is the CK Balling stencil. On the other hand the laser-cut LTCC stencil is used exclusively for SMD stencil printing.

Balling stencil

Example of a Semicon stencil:

The Balling stencil from Christian Koenen applies Flip-chip Bumps as efficiently as possible to wafers or substrates.

SMD stencils and Semicon stencils are precision tools. Learn how our stencil production ensures optimal printing quality:

SMD Stencil Production

Which SMD stencils and Semicon stencils are available?

Suitable for the respective field of application, as one of the technology leaders in the manufacture of stencils, Christian Koenen offers a wide range of high quality SMD stencils and Semicon stencils. With the exception of the CK LTCC stencil and the CK Balling stencil, all stencils are suitable, both for the SMD assembly as well as the semiconductor production. The CK Balling stencil has been developed especially for the semiconductor market, in order to apply solder balls highly efficiently to wafers or substrates. The laser-cut LTCC stencils (e.g.: VIA-Fill stencils) guide the applied conductive paste exactly into the Micro-VIAs of the ceramic substrate over superfine openings. VIAs are vertical electrical connections between two layers, for example the conductor tracks on layer 1 to the conductor tracks on level 2.

Overview for the application of SMD stencils and Semicon stencils

█ █	CK Soldering paste stencil
█ █	CK Step stencil
█ █	CK 3D stencil
█ █	CK Rework stencil
	CK Glue printing stencil
█ █	CK Nanovate Nickel stencil

█	CK Plasma coating
█	CK Electrolytic polishing
█ █	CK Wafer Bumping stencil
█	CK Balling stencil
█	CK LTCC stencil
█ █	CK M-TeCK stencil

█ = SMD Stencil █ = Semicon Stencil █ = additional finishing

What is the difference between SMT and THT?

In assembly and connection technology a distinction is made between Surface Mount Technology and Through Hole Technology. With the Surface Mount Technology (SMT) the respective SMD component (Surface Mounted Device) is mounted directly on the surface. With the Through Hole Technology (THT) wired electronic components are inserted through contact holes in the circuit board and then soldered.

The SMD or THT assembly normally takes place automatically on special machines. The SMT method has experienced increasing significance since the 80s. In comparison to conventional design per through contacting, the SMD surface mounting permits a very dense and above all two-sided circuit board assembly. As a result electronic devices can be manufactured smaller and considerably cheaper.

Automatic assembly with SMT (Surface Mounted Technology). An efficient SMT production requires an efficient and precise printing process with precisely manufactured SMD stencils.

A further method of the assembly and connection technology is the Flip-Chip assembly. Thereby bare dies (semiconductor chips) are mounted on the substrate or the circuit carriers. The name of the method is based on the orientation of the chips to the substrate or circuit carrier.

You want to optimise your SMD, THT or Flip-Chip assembly? Contact our experts now and reduce your production costs.

Process consulting

What is a PCB stencil?

The English name for SMD Schablone is PCB SMD Stencil, whereby PCB stands for Printed Circuit Board. Therefore the term PCB stencil or printed circuit board stencil is also common. At Christian Koenen you can order a variety of precisely manufactured SMD stencils. Besides soldering paste stencils and adhesive printing stencils, this also includes step stencils and 3D stencils or the CK patented Nanovate® nickel stencil for particularly small apertures with very sharp cut edges.

Why are there framed and frameless SMD stencils?

SMD stencils and Semicon stencils are designed either framed or frameless. Frameless SMD stencils for PCB circuit boards are also called "Foils" and fixed with stencil clamping systems with reusable stencil frames for the stencil holder. Their benefit is that they do not have to be glued permanently in the frame. This reduces the costs in comparison to framed SMD stencils and saves space in the SMD stencil rack or in general with the storage of the SMD stencils. In contrast framed SMD stencils are a little more robust.

Better framed or frameless?

At Christian Koenen you will also find SMD Quick clamping frames for your screen or stencil printer as well as a variety of clamping systems.

Do you know the quick clamping system Stencilman?

Get to know it now!

Versatile and economical: The Stencilman clamping system keeps the stencil tensioned with compressed air.

FAQ

Why do SMD stencils and Semicon stencils have to be manufactured so precisely?

The use of high quality SMD stencils and Semicon stencils is of great importance for the quality of the end products. The more precisely the stencil manufacturer produces the recesses, the more accurately the soldering paste will be applied to the required areas. A particularly exact method is laser cutting, which is why SMD stencils and Semicon stencils are sometimes also called laser-cut stencils.

If the SMD stencil or the Semicon stencil is not manufactured precisely enough or is manufactured from poor stencil material, this can lead to problems.

This includes, for example:

uneven soldering paste application,
insufficient connections between component and circuit board
or poor solder joints.

The consequence of such quality defects can be malfunctions in the electronic devices. For the manufacturers and providers of the SMD electronics, that can mean high costs for device repairs, product recalls or loss of image.

You want to have a suitable SMD stencil laser cut?

Contact us. We will find the most suitable printing stencil for you!

Contact

How can quality problems be avoided?

If high quality SMD stencils and Semicon stencils are used, serious product errors can be avoided. The precise application of soldering paste with the stencil ensures an even and reliable connection between component and circuit board. As a result the error ratio in production sinks and more functional end products can go into operation.

As an experienced plastic and metal stencil manufacturer, Christian Koenen offers a great variety of high quality SMD stencils and Semicon stencils, that are manufactured with the latest technology. We use only the best stencil materials and make sure, that every single SMD stencil or Semicon stencil is tailored exactly to the individual requirements of our customers. Apart from that we have an enormous filing rack with SMD stencils. Maybe the perfect template for your application is already there!

You have specific questions about SMT stencils, THT stencils or Semicon stencils?

Contact us. We are happy to advise you – including process consulting and evaluations in our Application Center.

How does SMD placement and SMD soldering work?

The term SMD placement describes the process, during which SMD components are placed on a circuit board. Typically, this takes place with the help of placement machines. Which electronic components are to be placed at which positions on a circuit board is evident in the layout diagram.

Before the surface placement with Surface Mounted Technology (SMT) a stencil printer applies soldering paste to the board positionally precise through the apertures of the SMT stencil. During SMT soldering the solder joints are heated. The soldering paste melts and connects the SMD components with the circuit board.

During THT soldering in the framework of Through-Hole-Technology first the contact points are printed, then the wired electronic components (THT components) are inserted and then soldered.

What does the soldering paste consist of for SMT soldering and THT soldering?

The soldering paste for SMT and THT, in other words surface mounting and through hole technology, consists of tiny balls of solder and a fluxing agent.

When the paste is heated the tiny balls melt and connect the assembled components with the contact surfaces on the circuit board.
The fluxing agent reinforces this connection, by breaking up oxides on the surfaces of the contacts.
There are various types of soldering paste, that are suitable for SMD components.
Used frequently are No-Clean, Halogen and Lead-free soldering pastes.

What is an SMD Rework Station?

Sometimes components on a circuit board or a substrate must be replaced during the course of a repair. At an SMD Rework Station first the SMD component concerned is removed from the circuit board. With the help of an SMD Rework Stencil the exact quantity of soldering paste is then applied directly to the free space. The circuit board thus prepared is then assembled with the new SMD component and the solder connection established through heating.

Repair of circuit boards: At an SMD Rework Station certain electronic components are exchanged with the help of special SMD stencils.

The world of SMD stencils and Semicon stencils keeps turning.

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Christian Koenen Group
HighTech Stencils

Otto-Hahn-Straße 24
85521 Ottobrunn-Riemerling
Germany

T +49 89 66 56 18 - 0
F +49 89 66 56 18 - 330

info@ck.de

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