Application Center: Your partner for optimizing printing processes

Analysis, tests & individual consulting as drivers for efficiency in electronics manufacturing

Consistently setting new standards is the challenge we all face. Innovation and progress mean being able to develop new technologies and optimize existing products. In technical printing, various influencing factors require an all-round view in order to design and optimize processes holistically. For us, efficiency therefore begins with analysis and testing. This is why we rely on print trials before the product is launched.

Because our customers often lack the capacity in their own production facilities or the time for a detailed problem analysis, we offer modern stencil and screen printing systems paired with the corresponding measuring and documentation equipment as well as a professional temperature-controlled production environment in our Application Center.

Application Center: Where technology and expertise meet

At our Application Center in Ottobrunn near Munich, we have the necessary equipment to implement and analyze stencil and screen printing. A rework station is available for applications in which individual components are to be assembled and soldered. A fully automatic stencil and substrate washing system and a manual cleaning station cover the area of printing tool cleaning. The technical laboratory is equipped with high-quality machinery. It is used to develop new manufacturing processes and optimize existing products. In addition, we make the performance potential of our laboratory available.

We look at and understand the entire manufacturing process so that our customers benefit from bundled expertise. In all areas relating to technical printing, they are supported by a competent team of engineers and trained specialists. We are convinced that where technology and expertise come together, innovation is unleashed and efficiency begins.

By cooperating with partners, universities and research institutes, we pool our expertise in machines, components, materials and processes for the production of electronic assemblies. In addition to the technical infrastructure, we provide knowledge that enables the Application Center to be used as a joint analysis center to develop new products, analyze or optimize existing ones and find and avoid errors.

Measurement of electronics manufacturing: Efficiency is created when errors are avoided

Position measurement on substrates
Detection of PCB distortions or panel splits with subsequent adaptation of the CAD data for the stencil so that the pads can be printed optimally. This minimizes printing errors and scattering in the solder paste application, stabilizes the process and increases the efficiency of the line.

Scaling of the stencil data — Figure 1: Deviations of the pad positions of a PCB from the target values. The arrangement of the panels indicates a length scaling of the PCB.

Figure 2: Residual deviations after scaling (adjustment) of the stencil data to the actual values of the pad positions. Optimum printing of the pads is possible again.

Evenness measurement on substrates
Elevations such as too much solder resist, plugged vias, marking print or labels can lead to massive printing problems. This can be optimized by checking the substrates for surface evenness in areas relevant to the printing process. The raised areas prevent sealing between the pad and stencil and cause additional bounce during printing. This results in an increased cleaning requirement between printing cycles and an increased paste volume. By measuring the unevenness, cavities can be integrated into the stencil to create space for the raised areas so that printing can be carried out again without chipping. The surface scanner has a working area of (300 x 300) mm2 and a resolution of 0.1 μm in height and 1 μm in x and y.

Documentation, measurement of pad and opening sizes
The microscopes are used to determine pad and aperture dimensions in order to identify any size deviations from the CAD data and, if necessary, to take them into account during data processing. In addition, images of substrates, components, printing and soldering results are created to clearly illustrate error mechanisms, solution approaches and printing processes. The microscopes have a magnification range of 16x to 160x or 80x to 1,000x.

Christian Koenen Application Center — Figure 3: Microscope for measuring pad structures and documenting test results.

3D measurement of printed deposits
The fast, automatic and three-dimensional measurement of printed deposits with the solder paste inspection system from Koh Young enables the statistical evaluation of the printing result. This allows a direct comparison of the effects of different parameters. The system supports the inspection of new component layouts and helps to analyze faults in existing products.

Contact angle measuring station
The contact angle measuring station can be used to determine the contact angle of the screen or stencil surface. This allows us to select the best material or coating for your process.

Analysis options paired with expertise and individual advice

With technical infrastructure, a strong network of partners, engineers and years of expertise, we combine the essential criteria for the success of our customers' electronics production in the Application Center. We offer them a place for individual analysis, troubleshooting, testing and consulting, so that nothing prevents them from increasing efficiency in production.

Please contact us directly if you would like to find out more about using the Application Center.

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