Wafer and LTCC stencils
Highest precision
Special stencils for printing on various media in the semiconductor and hybrid field are markedly more demanding in terms of precision, performance and release behaviour.
The special stencils for Wafer and LTCC are characterized by very low base material thickness as well as a large number of densely clustered, very small apertures. In these applications, the surface volume is reduced by up to 70 % by the high density of the apertures.
Technical Information
| Stainless steel thickness: | from 20 µm |
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| Max. printing format: | 720 mm x 615 mm |
| Max. stencil size: | 850 mm x 620 mm |
| Smallest realizeable structure: | 20 µm |
Characteristics
| Highly precise apertures |
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| Even material thickness |
| Even material surface |
| Apertures free of burrs and residues |
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