Highest Precision

Special stencils for printing on various media in the semiconductor and hybrid field are markedly more demanding in terms of precision, performance and release behaviour.

The special stencils for Wafer and LTCC are characterized by very low base material thickness as well as a large number of densely clustered, very small apertures. In these applications, the surface volume is reduced by up to 70 % by the high density of the apertures.

Technical Information

Stainless steel thickness: from 20 µm
Max. printing format: 720 mm x 615 mm
Max. stencil size: 850 mm x 620 mm
Smallest realizeable structure: 20 µm


Highly precise apertures
Even material thickness
Even material surface
Apertures free of burrs and residues