Stencils for solder paste and adhesive printing
Precision made by the technology leader
We produce laser stencils with extremely high precision and thus provide optimal preconditions for production techniques such as solder paste printing of, for instance, μBGA or components of the size 01005. The apertures of the laser-cut stencils for paste or adhesive printing slightly taper towards the board side.
Special applications such as stepped stencils, wafers, surface methods and many more can be found on the next pages.
For the manufacture of adhesive stencils we have a component library, in which the optimum adhesive point size and number are stored for every component. Optionally we develop a component library together with you, adapted to your production processes.
Technical Information
| Stainless steel thicknesses: | 20 µm bis 600 µm |
|---|---|
| Maximum printing format: | 720 mm x 615 mm |
| Max. stencil size: | 850 mm x 620 mm |
| Smallest realizeable structure: | 20 µm |
| Custom sizes and thicknesses: | upon request |
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