Rework stencils are used to dip (immerse in flux or solder paste) or to precisely print components. Also a combination of the two applications is possible, for example if the ground plane of a component is printed and the angle pins are dipped.
The depth of the cavity in the dip stencil determines the flux or paste height on the component. The dip medium is filled into the cavity using a squeegee. After that, the component is dipped in the medium and lowered to the bottom of the cavity.
During subsequent lifting of the component, a reproducible amount of the dip medium remains adhered to the surface of the component connections and is thus available for repair soldering.
This procedure is suited for use on BGA designs in all sizes and on components with a sufficiently large height difference between the angle pins and the component body.