Stencils for technical printing
40 to 70 steps are taken to convert the raw material into the precision tool for you.
Solder paste and adhesive printing
Take profit by the high precision of our stencils.
Especially developed for the application of paste deposits of different heights in one process step and for compensating height differences.
Stencil technology in the 3rd dimension
3D technology is used to facilitate simultaneous printing on several levels of a substrate.
Wafer and LTCC Stencils
Special stencils for printing on various media in the semiconductor and hybrid field.
PumpPrint™- and Flex stencils
PumpPrint™ stencils are used when printed circuit boards are fitted in two separate work steps. Flex stencils for adhesive printing.
Galvanically structured and etched metal stencils
Galvanically structured stencils of pure nickel excel in particular by long service life and good release behaviour.
With perfect «tracing» you keep track, during the whole production process.
Stencils in fixed frames
Particularly recommendable for material thicknesses > 100 µm as well as in the Fine Pitch range.
Stencils for self mounting systems
For stencil thicknesses > 100 µm, self mounting systems are an inexpensive and space-saving alternative to stencils in fixed frames.
Rework stencils are used to dip (immerse in flux or solder paste) or to precisely print components.